Beth Keser, Ph.D., is a globally recognized leader in semiconductor packaging with over 30 years of industry experience. She is currently VP of Packaging at the photonics start-up Volantis Semiconductor and serves as VP of Technology at the International Microelectronics Assembly and Packaging Society (imaps.org). Previously, Dr. Keser led wafer-level packaging development and product qualification teams at Motorola, Freescale, Qualcomm, and Intel. She is the author of over 50 technical publications, the author of 2 books, and 3 book chapters, and holds 50 patents and patents pending related to advanced electronic packaging technologies. Dr. Keser received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. She is an IEEE Fellow and an IEEE EPS Distinguished Lecturer who was awarded the 2021 IEEE EPS Exceptional Technical Achievement Award for her seminal contributions and leadership in fan-out wafer-level packaging.
